The sputter target surface to be tested is automatically scanned with a test head which transmits and receives the ultrasound in frequencies of 0.2 to 50 Mhz. The sound goes through the target and the sound echo of the boundary surface, target bond layer, is displayed on a screen. Variations in the wetting, solder - target are depicted in different colours.
The target is dipped in water to achieve a certain and reliable measurement. Here, a certain restriction on target materials is prescribed, as these must be able to be dipped in water.
With our ultrasonic test device, we can check targets up to a length of 620 mm.