In order to find the appropriate procedure for bonding of target and back panel, different factors have to be taken into consideration.
We basically use three different procedures for the bonding and thus can ideally process every combination of target and →back panel.
|Indium bonding||Nanofoil® bonding||Adhering|
|Bond material used||Indium (In)||AgSn and Nanofoil®||Electrically conductive adhesive|
|Melting point solder joint||155°C||220°C||>250°C|
|suited for big differences of the expansion coefficient target/back panel||very suited||moderately suited||less suited|
|Effort of de-bonding||very low effort||low effort||high effort|